For more than 35 years Orthodyne Electronics has been a leader in wire bonding equipment for the power semiconductor, automotive, and industrial markets. Orthodyne manufactures wire bonders that ultrasonically weld round aluminum wires ranging from 25 to 500 microns (1 - 20 mils) in diameter. Bonders with Orthodyne's PowerRibbon® process ultrasonically weld aluminum ribbons from 750x75 to 2000x250 microns (30x3 - 80x10 mils) in cross-section. Recognized as the industry leader in automatic wedge bonders for power electronics and power semiconductors, Orthodyne has won the VLSI "10 Best Supplier" award for 17 consecutive years. Orthodyne products are known for their outstanding reliability, performance, and the industry's best after-sales support. In 2008, Orthodyne became a division of Kulicke & Soffa, the world's leading manufacturer of ball bonders. This exciting change brings new resources to Orthodyne's product development and manufacturing processes. Our customers can look forward to continuing innovation in the core technologies that have provided industry-leading process quality, productivity, and return on investment for Orthodyne's products.